Special Session/Workshop on New IP and Future Internet Data Planes (NIPFIP 2020)

Abstract

New waves of networking applications such as the Industry 4.0, the Tactile Internet, B5G and Holographic-Type Communications are putting unprecedented demands on networking infrastructure beyond 5G uRLLC that are pushing best-effort Internet technology beyond its limit. Current approaches mostly focus on fronthaul with Mobile Edge Compute (MEC) to address the uRLLC problem. However, midhaul and backhaul transport technologies lack low-latency, high-reliability, jitter, and zero-packet loss to meet the new requirements of high-precision services. At the same time, the need to rapidly adapt networks to the requirements of new services and operational needs without requiring lengthy development cycles by vendors or operators continues to grow. All this, coupled with new business realities and the emerging “Manynets” landscape that is supplanting the traditional Internet architecture, requires a fundamental rethinking of how internetworking is approached.
In order to address the new challenges, recently a new Internet data plane and transport framework have been proposed, New IP. New IP consists of three components: a new and highly-flexible addressing framework, new facilities to structure packet payloads to facilitate new network encoding and reliability schemes, and a “contract” framework also known as BPP that allows to dynamically determine the behaviour of flows from the network edge without needing to rely on external controllers.
We would like to solicit contributions regarding hot topics, work in progress, and recent advances related to Future Internet Data Planes in general and to New IP in particular. Authors are invited to submit original contributions written in English that have not been published or submitted for publication elsewhere. Technical papers must be formatted using the IEEE 2-column format and not exceed 6 pages. Short papers not exceeding 4 pages can be submitted as well. All papers need to be submitted through EDAS and will undergo a peer review process. In addition, we welcome proposals for demos which should be sent directly to the organizers.

 

Papers will be fully peer reviewed. IEEE takes the protection of intellectual property very seriously. All submissions will be screened for plagiarism using Cross Check. By submitting your work you agree to allow IEEE to screen your work for plagiarism: http://www.crossref.org/crosscheck/index.html

How to submit
Technical paper submissions can be up to 6 pages long and should be written either in an MS Word format or in a Latex format using the templates available at https://www.ieee.org/conferences/publishing/templates.html. All papers must be submitted electronically.

Submissions accepted through this EDAS Link

 

Important Dates

Important dates for Workshop and Special Session Paper Submission
Deadline for paper submission: May 1, 2020  June 30, 2020
Acceptance Notification: June 30, 2020 July 15, 2020
Camera-Ready Submission: July 31, 2020

Workshop:  TBD (10-12 September 2020)

 

Organizers


Alexander Clemm
Futurewei, USA
alex@futurewei.com

Kiran Makhijani
Futurewei, USA
kiranm@futurewei.com

Uma Chunduri
Futurewei, USA
uma.chunduri@futurewei.com

Technical Program Committee

  • Uma Chunduri
    Futurewei, USA
  • Alexander Clemm
    Futurewei, USA
  • Luis Contreras
    Telefonica, Spain
  • Jerome Francois
    INRIA Nancy – Grand Est, France
  • Lisandro Zambenedetti Granville
    UFRGS, Brazil

  • Yuhui Luo
    NPL, United Kingdom
  • Kiran Makhijani
    Futurewei, USA
  • Yutaka Miyake
    KDDI, Japan
  • Hemanth Kumar Ravuri
    University of Ghent, Belgium
  • Maria Torres Vega
    University of Ghent, Belgium
  • Mohamed Faten Zhani
    ETS Montreal, Canada